▎ 摘　　要

NOVELTY - Metal-based copper clad laminate with high Tg and high thermal conductivity, comprises metal base layer, insulating layer and copper foil layer. The insulating layer is located between the metal base layer and the copper foil layer. The insulating layer comprises 20.40-22.40% of silicone resin, 35.40-37.40% phenolic epoxy resin, 8.50-9.30% dicyandiamide solution, 7.40-8.20% modified filler, and organic solvents (remaining amount). USE - Metal-based copper clad laminate with high Tg and high thermal conductivity used in a printed circuit board (PCB) material. ADVANTAGE - The high Tg high heat-conducting metal-based copper-clad plate has high heat conductivity and high temperature resistance, and ensures the elastic rebound performance of the plate after high temperature processing, good structure strength and resilience performance, and prevents the plate from being damaged. The aluminum hydroxide and graphene oxide in the modified filler are compounded to effectively enhance the high thermal conductivity of the insulating layer, and the polyimide fiber and the graphene oxide are matched to use, thus effectively enhancing the high temperature resistivity and structure strength of the insulation layer. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for processing a metal-based copper clad laminate with high Tg and high thermal conductivity.