▎ 摘　　要

NOVELTY - Resin composition comprises a resin composition comprising a resin and a filler provided in the resin, where the resin includes a soluble liquid crystal polymer resin, the filler has a negative coefficient of thermal expansion (negative CTE) and provided in the soluble liquid crystal polymer resin. USE - Resin composition used for semiconductor package. ADVANTAGE - The resin composition has low dielectric constant, low dielectric loss, and low coefficient of thermal expansion, and improves electrical properties, mechanical properties, and thermal properties by providing the resin of the insulating layer using the liquid crystal polymer resin. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: 1. a copper clad laminate, which comprises an insulating layer, and a metal layer provided on one surface of the insulating layer, where the insulating layer includes a resin and a filler provided in the resin, the resin includes a soluble liquid crystal polymer resin, and the filler has a negative coefficient of thermal expansion (negative CTE) and is provided in the soluble liquid crystal polymer resin; and 2. a circuit board, which comprises an insulating layer, and a circuit pattern layer provided on the insulating layer, where the insulating layer includes a resin including a soluble liquid crystal polymer resin, and a filler provided in the resin and having a negative coefficient of thermal expansion (negative CTE), and the filler has a negative coefficient of thermal expansion (negative CTE) in a thickness direction of the insulating layer.