▎ 摘　　要

NOVELTY - A LED light emitting module comprises transparent gel film provided with multiple LED chips where electrode surface of each LED chip is connected to circuit board through conductive material and LED chips are arranged to form chip array. The light-emitting surface of the chip faces the transparent gel film. The electrode surface of the LED chip faces away from the transparent gel-like film. The LED chip is embedded in the transparent gel film, The distance between the electrode surface of the LED chip and the surface of the transparent colloidal film close to the electrode surface does not exceed 30 microns. The electrode surface of the LED chip is connected to the circuit board through a conductive material. USE - LED light emitting module for printed circuit board. ADVANTAGE - The module combines the mass transfer process with the mature printed circuit board (PCB) manufacturing process, and solves the problem that the existing PCB single grain-fixing efficiency is low yield, and the process of the PCB manufacturing precision is reduced compared with the existing die bonding process. The manufacturing cost is reduced and the process yield is greatly improved. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for manufacture of the LED light emitting module; and #processing method of microstructure used to manufacture the microstructure on the upper surface of the transparent colloidal film, which involves selecting the substrate, forming a number of microstructure grooves with different structures on the substrate by inductively coupled plasma etching or chemical etching, and pressing the formed microstructure grooves on the transparent colloidal film, so that several irregular microstructures are formed on the transparent colloidal film.