• 专利标题:   Non-silver-based solder comprises silver, zinc, tin, nickel, indium, cobalt, graphene, copper, and impurities.
  • 专利号:   CN106862798-A
  • 发明人:   LIU D
  • 专利权人:   ANHUI HUAZHONG WELDING IND CO LTD
  • 国际专利分类:   B23K035/14, B23K035/30, B23K035/40
  • 专利详细信息:   CN106862798-A 20 Jun 2017 B23K-035/30 201755 Pages: 6 Chinese
  • 申请详细信息:   CN106862798-A CN11247738 29 Dec 2016
  • 优先权号:   CN11247738

▎ 摘  要

NOVELTY - Non-silver-based solder comprises 39-41 wt.% silver, 29.5-31.5 wt.% zinc, 2.5-3.5 wt.% tin, 1.3-1.7 wt.% nickel, 0.1-0.2 wt.% indium, 0.05-0.10 wt.% cobalt, 0.01-0.02 wt.% graphene, and balance copper and impurities. USE - Non-silver-based solder. ADVANTAGE - The non-silver-based solder produces stainless steel welding joint strength of 140 MPa, has good spreading properties, and has good plasticity. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for preparation of non-silver-based solder by grinding raw materials except for graphene to obtain 100-150 meshes powder; adding graphene to alcohol; ultrasonic treating; putting graphene alcohol solution and alloy powder into high-energy ball mill; ball milling for 150-200 revolutions per minute at 150-200 degrees C for 10-15 minutes; drying ground graphene and alloy powder mixture; putting dried mixture into grinding tool; extrusion molding; and sintering powder at 250-300 degrees C for 3-5 hours to obtain aluminum-magnesium alloy solder.