• 专利标题:   Functional adhesive composition for electronic products, contains curing agent, silver fine particles which is capable of providing electroconductivity and thermal conductivity, adhesive binder and graphene functioning agent.
  • 专利号:   KR2012082709-A, KR1258441-B1
  • 发明人:   LEE D W, SONG K S
  • 专利权人:   UNIV CHONBUK NAT IND COOP FOUND
  • 国际专利分类:   B05D003/06, C09J011/04, C09J005/00, C09J009/02
  • 专利详细信息:   KR2012082709-A 24 Jul 2012 C09J-009/02 201257 Pages: 9
  • 申请详细信息:   KR2012082709-A KR004155 14 Jan 2011
  • 优先权号:   KR004155

▎ 摘  要

NOVELTY - A functional adhesive composition contains curing agent which solidifies adhesive binder, silver fine particles which is capable of providing electroconductivity and thermal conductivity to adhesive, adhesive binder and graphene functioning agent as heat supply source which thermally melts the nanosilver fine particles. The silver fine particles have improved dispersibility. USE - Functional adhesive composition is used for electronic products. ADVANTAGE - The electronic product formed using the functional adhesive composition has excellent interface resistance, electroconductivity and thermal conductivity.