• 专利标题:   Electronic device e.g. notebook type personal computer (PC) has thermally-conductive plate that is arranged so that thermal absorption of heat generated by second heat generating portion is possible.
  • 专利号:   JP6934093-B1, US2022015260-A1, CN113934277-A, JP2022016917-A, US11547017-B2
  • 发明人:   UCHINO A, UEMURA T, YAMAZAKI H, AMANO M, KAMIMURA T
  • 专利权人:   LENOVO SINGAPORE PTE LTD, LENOVO SINGAPORE PTE LTD, LENOVO SINGAPORE PTE LTD
  • 国际专利分类:   G06F001/20, H01L023/427, H05K007/20
  • 专利详细信息:   JP6934093-B1 08 Sep 2021 G06F-001/20 202178 Pages: 14 Japanese
  • 申请详细信息:   JP6934093-B1 JP119910 13 Jul 2020
  • 优先权号:   JP119910

▎ 摘  要

NOVELTY - The electronic device has a first heat generating portion and second heat generating portion which are provided in a housing. A cooling module (22) thermally absorbs the heat generated by the heat-generating portions. A vapor chamber (34) is formed in a portion pinched between a first metal plate (36) and a second metal plate (41), and provided to enclose the working fluid with sealed space. A thermally-conductive plate (37) containing graphene is supported by a metal frame (35). The vapor chamber and the thermally conductive plate are arranged so that thermal absorption of the heat produced by the first and second metal plates is possible. A ventilation fan is provided to ventilate a cooling fin (38) that is thermally connected with the metal plate. USE - Electronic device e.g. notebook type personal computer of clamshell type. Can also be used in mobile telephone, smartphone or portable game machine. ADVANTAGE - The number of components can be reduced, and the weight reduction of the electronic device can be achieved. DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of the cooling module and side surface of the motherboard in electronic device. (Drawing includes non-English language text) Cooling module (22) Vapor chamber (34) Metal frame (35) First metal plate (36) Thermally-conductive plate (37) Cooling fin (38) Second metal plate (41)