▎ 摘　　要

NOVELTY - The gasket (10) has a reinforcing fiber (1), a heat conducting film (2) and a bonding agent (3). The reinforcing fiber is inserted in the heat conducting film. The heat conducting film forms a wave-shaped structure. The adhesive is filled in the gap of the wave-shaped structure. The reinforcing fibre is selected from carbon fiber, graphite fiber, graphene fiber, ceramic fiber, metal fiber, mullite fiber, cellulose fiber, and quartz fiber, high heat-conducting carbon fiber, high heat-conducting graphite fiber. The adhesive is selected from epoxy resin, acrylic resin, organic silicon rubber, the organic silicon rubber is liquid silicon rubber, selected from, -dihydroxy polydimethyl siloxane, polydimethyl cyclosiloxane; polydimethylsiloxane, polydiphenylsiloxane, - dihydroxy polymethyl (3, 3, 3-trifluoropropyl) siloxane, , -diethyl dimethyl silicone polymer, of cyano silicon silane. USE - Heat conducting gasket used for electronic device. ADVANTAGE - The heat conducting gasket has good heat-conducting performance and compression rebound resilience in the longitudinal direction. Due to the presence of the wave-shaped structure, it can form stable and compact bonding, and improves the compression rebound resilient, so the gasket is not easy to crack. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for preparing heat conducting gasket. DESCRIPTION OF DRAWING(S) - The drawing shows a perspective view of the heat conducting gasket. (Drawing includes non-English language text) Reinforcing fiber (1) Heat conducting film (2) Bonding agent (3) Heat conducting gasket (10)