• 专利标题:   Graphene wiring structure comprises multilayer graphene and interlayer composites provided between layers of multilayer graphene, such that portion of defect and grain boundary of planar graphene sheet are closed.
  • 专利号:   JP5944547-B1, US2016284646-A1, JP2016175814-A, US9679851-B2
  • 发明人:   SAKAI T, MIYAZAKI H, KATAGIRI M, YAMAZAKI Y
  • 专利权人:   TOSHIBA KK, TOSHIBA KK
  • 国际专利分类:   C01B031/02, H01L021/3205, H01L021/768, H01L023/532, H01L021/02, H01L023/528
  • 专利详细信息:   JP5944547-B1 05 Jul 2016 C01B-031/02 201648 Pages: 12 Japanese
  • 申请详细信息:   JP5944547-B1 JP059052 23 Mar 2015
  • 优先权号:   JP059052

▎ 摘  要

NOVELTY - A graphene wiring structure comprises multilayer graphene, interlayer composite (a1) between layers of multilayer graphene, and interlayer composite (a2) containing oxide, carbide and/or nitride which exist in layers of multilayer graphene. The multilayer graphene is laminate formed by laminating planar graphene sheet. The interlayer composite (a2) is provided between layers of multilayer graphene, such that at least one portion of defect and grain boundary of planar graphene sheet are closed. USE - Graphene wiring structure (claimed). ADVANTAGE - The graphene wiring structure has low resistance, and improves reduction of intercalation effect of intercalation compound to graphene. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for manufacture of graphene wiring structure, which involves processing multilayer graphene into wiring shape, inserting interlayer composite (a1) between layers of multilayer graphene, and providing interlayer composite (a2) on resultant product.