▎ 摘　　要

NOVELTY - A halogen-free, flame-retardant, high-temperature-resistant epoxy resin adhesive comprises a resin matrix component (A) and a curing agent system (B). The component (A) contains 100 pts. wt. epoxy resin, 6-12 pts. wt. polyphosphoric amide modified graphene oxide and carbon nano tubes, 10-14 pts. wt. silane modified magnesium-aluminum hydrotalcite, 16-22 pts. wt. diluent, 1-4 pts. wt. anti-yellowing agent and 0.5-1.5 pts. wt. defoaming agent. The component (B) comprises 100 pts. wt. curing agent, 0.5-8 pts. wt. curing accelerator, 3-6 pts. wt. toughening agent, 6-10 pts. wt. coupling agent and 5-10 pts. wt. emulsifier. USE - As flame retardant epoxy resin adhesive. ADVANTAGE - The halogen-free, flame-retardant, high-temperature-resistant epoxy resin adhesive has mechanical property enhanced by the presence of the polyacrylamide modified graphene oxide, carbon nano tube and silane modified magnesium-aluminum hydrotalcite. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for the preparation of halogen-free, flame retardant, epoxy resin adhesive, which involves: 1) mixing epoxy resin, polyphosphoric acid amide modified graphene oxide, carbon nano tube and silane modified magnesium-aluminum hydrotalcite at 75-85℃ for 40-80 minutes, sequentially adding diluent, anti-yellowing agent and defoaming agent continuously stirring for 30-50 minutes and cooling to room temperature, to form component (A); 2) adding curing agent, curing accelerator, toughening agent, coupling agent and emulsifier into a kneader sequentially, kneading for 40-70 minutes at 60-90℃, cooling and discharging to form component (B). method-free flame-retardant high temperature-resistant epoxy resin sealing glue.