▎ 摘　　要

NOVELTY - A copper-graphene electroplating solution comprises copper sulfate, graphene, additive (A) and (B), cationic surfactant and chloride-containing electrolyte. The additive (A) is selected from one or more of 2-mercapto-5-benzimidazole sodium sulfonate, 2-methoxy-2-oxoethanesodium sulfonate and 4-nitro-N-methylbenzenesulfonic acid amide. The additive (B) is selected from one or more of sodium polydithio dipropyl sulfonate, sodium N,N-dimethyl-dithio-carbonyl propane sulfonate and 3-thio-isothiourea propane sulfonate sodium. USE - Copper-graphene electroplating solution used for preparing copper-graphene composite foil (claimed). ADVANTAGE - The copper-graphene electroplating solution has high tensile strength, low roughness and high surface roughness, and stable high temperature mechanical property, and ensures the ultra-thin surface of the copper foil with reduced roughness. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) preparation of copper-graphene composite foil; and (2) copper-graphene composite foil, which has a lamellar network structure, thickness of less than 4 μm, roughness of less than 2.0 μm, tensile strength of greater than 470 MPa, and tensile strength of greater than 450 MPa. The copper foil is used as a matrix, and graphene is used as a reinforcing phase.