▎ 摘　　要

NOVELTY - The device has a semiconductor heating plate hot end (12) formed with a heating cavity (3). A cooling cavity (2) is matched between a semiconductor heating plate (1) and a semiconductor heating plate cold end (11). A graphene layer is arranged between an N-type semiconductor and a P-type semiconductor. The heating cavity is matched with water inlet and outlets ends (31, 32). A water storage cavity (33) is matched between water inlet and outlet ends. The semiconductor heating plate is formed with the water storage cavity. USE - Semiconductor refrigerator and water heater integrating device. ADVANTAGE - The device improves temperature difference between the semiconductor heating plate heat and cold ends. DESCRIPTION OF DRAWING(S) - The drawing shows a front view of a semiconductor refrigerator and water heater integrating device. Semiconductor heating plate (1) Cooling cavity (2) Heating cavity (3) Semiconductor heating plate cold end (11) Semiconductor heating plate hot end (12) Water inlet end (31) Water outlet end (32) Water storage cavity (33)