▎ 摘　　要

NOVELTY - Encapsulating resin composition comprises a resin matrix and a filler, where the resin matrix contains an epoxy resin and an epoxy resin curing agent; the filler contains a thermally conductive filler and a shielding filler, and the thermal conductivity of the thermally conductive filler exceeds 2W/(m.K) at 25degreesC, the conductivity of the shielding filler exceeds 102 S/m at 25degreesC, and the shielding filler and the thermally conductive filler account for 40-70% of the combination of the encapsulating resin mass percentage of the material. USE - The composition is useful for a surface acoustic wave device (claimed). ADVANTAGE - The encapsulating resin composition for surface acoustic wave device can not only ensure that the encapsulating resin has excellent heat dissipation, but also can reduce the insertion loss of the surface acoustic wave device by forming a continuous shielding structure, and can meet the requirements of high frequency and high frequency. Power surface acoustic wave devices require comprehensive performance such as high thermal conductivity and low insertion loss DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: a laminate, comprising: a resin substrate comprising epoxy resin and an epoxy resin curing agent; a shielding layer laminated on the resin substrate, the shielding layer comprising encapsulating resin composition; a thermally conductive layer laminated on the shielding layer, and the thermally conductive layer includes a thermally conductive filler; and preparing a laminate, comprising: (i) mixing epoxy resin, epoxy resin curing agent, thermally conductive filler and shielding filler to form a resin substrate, shielding layer and thermally conductive layer, where the thermally conductive filler is on the thermally conductive layer, the shielding layer and the resin substrate; (ii) in a vacuum environment, heating and pressing the thermally conductive layer, the shielding layer and the resin substrate in sequence to form a laminate; and (iii) grinding and polishing the surface of the laminate. DESCRIPTION OF DRAWING(S) - Encapsulating resin composition (105) Resin matrix (105-1) Heat conducting filler (105-21) Shielding filler (105-22)