• 专利标题:   Method of fabricating graphene FET, involves forming cuts in two different portions of graphene layer.
  • 专利号:   US2013337620-A1, US8772098-B2
  • 发明人:   DIMITRAKOPOULOS C D, FRANKLIN A D, SMITH J T
  • 专利权人:   INT BUSINESS MACHINES CORP
  • 国际专利分类:   B82Y040/00, H01L021/20, H01L021/336
  • 专利详细信息:   US2013337620-A1 19 Dec 2013 H01L-021/336 201401 Pages: 7 English
  • 申请详细信息:   US2013337620-A1 US524191 15 Jun 2012
  • 优先权号:   US524191

▎ 摘  要

NOVELTY - A graphene layer (203) is formed on a substrate (201). Several cuts (230) are formed in two different portions of the graphene layer. A source region is formed in one portion of the graphene layer. A drain region is formed in another portion of graphene layer. The source and drain regions are formed in the spaced apart state. USE - Method of fabricating graphene FET. ADVANTAGE - The contact resistance in the graphene FET is reduced by forming cuts in the graphene layer. The minimization of contact length and reduction of noise are possible. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of the structure of the graphene FET. FET (200) Substrate (201) Graphene layer (203) Source electrode (204) Drain electrode (205) Cut (230)