▎ 摘　　要

NOVELTY - Modified epoxy resin adhesive comprises 50-80 pts. wt. bisphenol A epoxy resin, 10-20 pts. wt. m-phenylenediamine, 1-2 pts. wt. oxidized graphene, 5-8 pts. wt. nano zirconium oxide, 0.4-0.5 pts. wt. carbon nanotube, 0.4-0.5 pts. wt. silane coupling agent, 0.4-0.5 pts. wt. aluminum isopropoxide and 5-10 pts. wt. butylglycidyl ether. USE - Modified epoxy resin adhesive used in LED chip packaging (claimed). ADVANTAGE - Modified epoxy resin adhesive has high thermal conductivity, high electromagnetic shielding effect, high efficiency, effective light irradiation rate and extends lamp life in simple manner. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for preparing modified epoxy resin adhesive, which involves: (A) mixing nano zirconium oxide and silane coupling agent to disperse for 20-30 minutes; (B) adding aluminum isopropoxide and carbon nanotubes into butyl glycidyl ether; (C) carrying out ultrasonic treatment to obtain transparent sol; (D) mixing oxidized graphene and m-phenylenediamine under mixing; and (E) adding bisphenol A epoxy resin under stirring and mixing, and then mixture defoaming under vacuum to obtain final product.