• 专利标题:   Heat-conducting graphene sheet filling hole copper-covering structure for use in electronic radiating field, has heat conducting graphene sheet whose upper and lower surfaces are uniformly coated with copper layer.
  • 专利号:   CN216513665-U
  • 发明人:   LIU Y, HUANG K, QIN F, WEI T
  • 专利权人:   SHENZHEN MATTERENE TECH CO LTD
  • 国际专利分类:   C01B032/194, C09K005/14, C23C018/40, C25D003/38, C25D005/54
  • 专利详细信息:   CN216513665-U 13 May 2022 C09K-005/14 202253 Chinese
  • 申请详细信息:   CN216513665-U CN22584068 26 Oct 2021
  • 优先权号:   CN22584068

▎ 摘  要

NOVELTY - The utility model model relates to the field of radiating equipment, specifically relates to a heat conducting graphene sheet filling hole copper-covered structure. the heat conducting graphene sheet is porous sheet structure, the through hole of the heat conducting sheet graphene filled with copper, the upper and lower surface of the heat conducting graphene sheet are uniformly coated with copper layer, the filling copper in the through hole is integrally connected with the copper layer. utility model guide heat conducting graphene sheet filling hole copper-covered structure, through filling copper in the hole, and surface a certain thickness of copper, realizing full copper filling and coating, the heat conducting graphene sheet and copper sheet are firmly fixed, the composite film structure strength is high, at the same time, improving the heat conductivity of the vertical direction of the heat conducting graphene sheet.