▎ 摘　　要

NOVELTY - Preparation of imide compound guide sleeve involves weighing 100-130 pts. wt. polyetherimide resin, 5-10 pts. wt. lubricant, 2-5 pts. wt. graphene, 10-20 pts. wt. para-phenylene diamine, 50-80 pts. wt. polycarbonate resin, 1-5 pts. wt. toughening agent and 2-8 pts. wt. antioxidant; mixing polyetherimide resin and polycarbonate resin into high speed mixer for 0.5-1 hour to obtain first mixture; mixing first mixture in ultrasonic instrument, ultrasonically crushing for 0.5-1 hour, filtering, and drying to obtain first powdered mixture; and mixing lubricant, graphene and phenylenediamine. USE - Method for preparing imide compound guide sleeve (claimed). ADVANTAGE - The sleeve has high intensity, modulus and heat resistant temperature, large impact strength, and no deformation and cracking. DETAILED DESCRIPTION - Preparation of imide compound guide sleeve comprises weighing 100-130 pts. wt. polyetherimide resin, 5-10 pts. wt. lubricant, 2-5 pts. wt. graphene, 10-20 pts. wt. para-phenylene diamine, 50-80 pts. wt. polycarbonate resin, 1-5 pts. wt. toughening agent and 2-8 pts. wt. antioxidant; mixing polyetherimide resin and polycarbonate resin into high speed mixer for 0.5-1 hour to obtain first mixture; mixing first mixture in ultrasonic instrument, ultrasonically crushing for 0.5-1 hour, filtering, and drying to obtain first powdered mixture; mixing lubricant, graphene, phenylenediamine, toughening agent, antioxidant and first powder-shaped mixture into the mixer to obtain second mixture; preheating second mixture into double-screw extruder hopper, and extruding at first area temperature of 330-360 degrees C, second area temperature of 360-380 degrees C, third area temperature of 380-410 degrees c, fifth area temperature of 410-440 degrees C and sixth area temperature of 400-420 degrees C; and blow molding, air blowing, cooling, and cutting.