▎ 摘　　要

NOVELTY - Packaging method of chip, comprises mounting semifinished product chip on the upper surface of the metal support, sputtering a layer of graphene on the lower surface of the metal support of the semi-finished product chip, connecting the semi-finished product chip and the lead wire through the bonding wire respectively, processing the bottom of the semi-finished product chip structure by using the way of laser boring or plasma cleaning, exposing the bump of the chip, passivating the pattern, wiring, depositing the lower metal layer and etching the embedded ball grid array process to obtain the chip packaging structure. USE - The method is useful for packaging method of chip. ADVANTAGE - The method reduces the phenomenon of drift and warping of the chip, sputtering a layer of graphene on the back surface of the metal support of the semi-finished product chip to improve the radiating effect of chip, and the heat generated in the working process of chip will be emitted out through metal support. The chip directly hot pressing e.g. material layer can quickly finish the injection curing process, reducing the process of packaging, and reducing the drift of chip. In addition, the chip packaging method is added with polytetrafluoroethylene or polyvinyl chloride between the glass plate and ABF material layer, which can reduce the internal stress of chip packaging structure, and it is good for avoiding phenomenon of warping. DESCRIPTION OF DRAWING(S) - The drawing shows a flow chart of the packaging method of chip(Drawing includes non-English language text).