• 专利标题:   Manufacture of substrate for electronic apparatus, involves forming silicon carbide layer on silicon substrate, planarizing upper surface of silicon carbide layer, and forming graphene layer in upper surface of silicon carbide layer.
  • 专利号:   JP2014240340-A
  • 发明人:   SAI J, SUEMITSU M, FUKIDOME H, MAKABE I, NAKABAYASHI T, TATENO Y
  • 专利权人:   SUMITOMO ELECTRIC IND LTD, UNIV TOHOKU
  • 国际专利分类:   C01B031/02, C01B031/36, H01L021/205, H01L021/336, H01L029/78, H01L051/05, H01L051/30
  • 专利详细信息:   JP2014240340-A 25 Dec 2014 C01B-031/02 201503 Pages: 15 Japanese
  • 申请详细信息:   JP2014240340-A JP124109 12 Jun 2013
  • 优先权号:   JP124109

▎ 摘  要

NOVELTY - Manufacture of substrate (100) involves forming a silicon carbide layer (14) on a silicon substrate (10), planarizing the upper surface of the silicon carbide layer so that the root mean square roughness of the upper surface of the silicon carbide layer is 12 nm or less, and forming a graphene layer (16) in the upper surface of the silicon carbide layer after performing the planarization process. USE - Manufacture of substrate used for forming electronic apparatus (all claimed) e.g. electronic device, optical device, and sensor device. ADVANTAGE - The method enables manufacture of substrate having excellent film quality of graphene layer. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of substrate. (Drawing includes non-English language text) Silicon substrate (10) Nitride semiconductor layer (12) Silicon carbide layer (14) Graphene layer (16) Substrate (100)