▎ 摘　　要

NOVELTY - Preparing organic framework modified epoxy resin anti-scuffing aqueous coating involves weighing proper amount of graphene oxide, coarsening it, sensitizing and activating treatment, selecting 8-12g/l copper sulfate, 0.6-1.0g/l nickel sulfate, 13-16g/l sodium citrate, 26-30g/l sodium hypophosphite, and 25-30g/l boric acid, preparing into chemical plating solution, under the condition of room temperature, according to the mass volume ratio of 1: 30-40g/ml, adding the reduced graphene into the plating solution, adjusting the pH value to11-12, reacting for 3-7min, after finishing reaction, naturally precipitating, centrifuging, washing, drying and crushing and grinding to obtain the nano-grade copper plating graphene, weighing appropriate amounts of cobalt chloride and manganese nitrate. USE - Method for preparing organic framework modified epoxy resin anti-scuffing aqueous coating. ADVANTAGE - The method enables to prepare organic framework modified epoxy resin anti-scuffing aqueous coating with improved scratch resistance performance. DETAILED DESCRIPTION - Preparing organic framework modified epoxy resin anti-scuffing aqueous coating involves weighing proper amount of graphene oxide, coarsening it, sensitizing and activating treatment, selecting 8-12g/l copper sulfate, 0.6-1.0g/l nickel sulfate, 13-16g/l sodium citrate, 26-30g/l sodium hypophosphite, and 25-30g/l boric acid, preparing into chemical plating solution, under the condition of room temperature, according to the mass volume ratio of 1: 30-40g/ml, adding the reduced graphene into the plating solution, adjusting the pH value to11-12, reacting for 3-7min, after finishing reaction,naturally precipitating, centrifuging, washing, drying and crushing and grinding to obtain the nano-gradecopper plating graphene, weighing appropriate amounts of cobalt chloride and manganese nitrate, dissolving them in N,N-dimethylformamide solution, adding appropriate amounts of terephthalic acid and copper-plated graphene at room temperature, transferring to fluoroethylene-lined stainless steel autoclave, reacting at 120-130 degrees C for 23-27h, cooling the product to room temperature, washing it with N,N-dimethylformamide solution 3-4 times, purify the product with ethanol, finally activating in a vacuum drying oven at 80-90 degrees C for 12-15h to obtain a powdered organometallic framework material composite, dispersing the powdered organometallic framework material composite in deionized water to obtain a dispersion, adding bisphenol A and epichlorohydrin to obtain a mixed solution, adding the first portion of the initiator to the mixed solution, reacting at 65-70 degrees C for 50-80min, adding the remaining initiator, reacting for 1-2h at 75-80 degrees C, after the reaction is over, washing with water and distilling to modify the organometallic framework epoxy resin. The organic metal skeleton modified epoxy resin is emulsified to obtain the epoxy resin emulsion, and then according to the mass fraction composition, the epoxy resin emulsion is 50-70 wt.%, the curing agent 10-20 wt.%, and the film forming aid 5- 10 wt.%, defoamer 0.3-0.8 wt.%, leveling agent 2-5 wt.%, wetting agent 2-4 wt.% and deionized deionized water. The mixture is dispersed at 500-800r/min speed to obtain desired product.