• 专利标题:   Chemically etching graphene-catalyzed silicon, comprises e.g. laminating graphene layer on the silicon layer, forming nano-templates on laminated graphene layer and forming graphene nanostructure with pattern mask.
  • 专利号:   KR1671627-B1, WO2016178452-A1
  • 发明人:   SUK H C, JUNG K K, CHOI S H, KIM J K
  • 专利权人:   UNIV KYUNGHEE IND COOP
  • 国际专利分类:   H01L021/306, H01L029/16, C23F001/10, C23F001/24
  • 专利详细信息:   KR1671627-B1 01 Nov 2016 H01L-021/306 201679 Pages: 19
  • 申请详细信息:   KR1671627-B1 KR063142 06 May 2015
  • 优先权号:   KR063142

▎ 摘  要

NOVELTY - Chemically etching graphene-catalyzed silicon, comprises (a) laminating graphene layer (220) on the silicon layer (210), (b) forming nano-templates on the laminated graphene layer and forming graphene nanostructure with pattern mask, and (c) forming silicon nanostructure on the silicon layer by chemical etching process using graphene nanostructure as catalyst. USE - The method is useful for producing semiconductor nanostructure. ADVANTAGE - The method can perform in strongly acidic solution having high toxicity. DETAILED DESCRIPTION - Chemically etching graphene-catalyzed silicon, comprises (a) laminating graphene layer on the silicon layer, (b) forming nano-templates on the laminated graphene layer and forming graphene nanostructure with pattern mask, and (c) forming silicon nanostructure on the silicon layer by chemical etching process using graphene nanostructure as catalyst. The silicon nanostructure includes silicon nano wire, silicon cone arrays, silicon hole arrays or porous silicon formed by chemical etching process using etching solution containing hydrofluoric acid and hydrogen peroxide under environment condition. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic representation of the. Silicon layer (210) Graphene layer (220) Nanospheres array (230)