▎ 摘　　要

NOVELTY - Processing and forming liquid cooling plate comprises (a) using high heat-conducting coefficient of aluminum alloy profile, sequentially acid eluting grease, coating anti-composite material graphene heat treatment, rolling composite, blowing and compounding under rolling speed of 0.3-0.6 m/minute, and fully combining two aluminum alloy profiles, (b) polishing and removing impurities on the surface of the aluminum alloy section by sandpaper, (c) pickling, removing the compact oxide film on the face of the aluminum alloy section bar, (d) degreasing, and drying, (e) uniformly mixing polydimethylsiloxane and graphene uniformly according to the weight ratio of 1:2, uniformly mixing dimethyl silicone polymer and graphene, preparing anti-compound graphene, coating the pre-set flow path loop graph, (f) controlling the heat treatment temperature at 400-450 ℃ and (g) rolling and compounding under the rolling speed of 0.3m/min to 0.6m/min, fully combining the two aluminum alloy profiles. USE - Processing and forming method of liquid cooling plate used in electronic component e.g. electronic display device, photoelectric device, sensor, power supply, switch, micro-motor, electronic transformer, relay, printed circuit board integrated circuit, various circuits, piezoelectric, crystal, quartz, ceramic magnetic material, base material substrate for printed circuit, electronic functional technique special material, electronic glue (belt) product and electronic chemical material. ADVANTAGE - The prepared liquid cooling plate has higher bending strength, better toughness, better radiating performance, and reduces the production cost and use cost. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic structural view of the processing and forming liquid cooling plate. 1Invention liquid cooling plate 2Comparative example 3Comparative example 4Turbulent flow sheet 11Inner chamber