• 专利标题:   Silicon glue heat conducting structure has silicon resin layer that is connected with adhesive layer, and graphene conducting film that is directly connected with heat cover and silicon resin layer.
  • 专利号:   CN204022746-U
  • 发明人:   WU F
  • 专利权人:   WU F
  • 国际专利分类:   B32B007/12, C09K005/14
  • 专利详细信息:   CN204022746-U 17 Dec 2014 C09K-005/14 201511 Pages: 5 Chinese
  • 申请详细信息:   CN204022746-U CN20299786 06 Jun 2014
  • 优先权号:   CN20299786

▎ 摘  要

NOVELTY - This utility new type claims a new-type silicon glue one heat conducting piece, comprising substrate layer and set in the base layer is a graphite heat conducting film, the base layer is silicon layer, the graphene conducting film and a silicon resin layer cover the adhesive or a graphite heat conducting film directly cover and the hanging quality layer mix, compose a uniform density, distribute reasonable, add graphite diluted in a resin, the heat conductivity of the normal ratio of heat-conducting silicon resin high dozens of times of valid use strong thermal conductivity of graphite, and in the application of the heat-conducting material preparation in a field, structure design is reasonable, application range is wide, it has a good market prospect.