▎ 摘　　要

NOVELTY - Heat-conducting adhesive film comprises 10-20 pts. wt. epoxy resin, 10-20 pts. wt. epoxy resin curing agent, 10-20 pts. wt. film-forming resin, 4-6 pts. wt. ethylene glycol diglycidyl ether, 8-12 pts. wt. propylene glycol methyl ether, 10-20 pts. wt. silicon micropowder, 8-12 pts. wt. glass powder, 0.4-0.6 pts. wt. nano dioxide, 0.4-0.6 pts. wt. quartz powder, 2-4 pts. wt. aluminum nitride, 2-3 pts. wt. silicon nitride, 1-2 pts. wt. graphene oxide, 1-2 pts. wt. aqueous-based dispersing agent and 0.4-0.6 pts. wt. aqueous-based wetting agent. USE - The heat-conducting adhesive film is useful for electronic module. ADVANTAGE - The adhesive film: solves the electronic module heat conducting problem, supports to reduce product volume design, solves the problem of bad high pressure; has good adhesive property; replaces mechanical fastening process, cold pressing fast curing, and stores for 2 months at normal temperature or in refrigerator at 0-10℃ for 6 months. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing the adhesive film, comprising (i) adding powder mixture silicon micro powder, glass powder, nano dioxide, quartz powder, aluminum nitride, silicon nitride, oxidation graphene aqueous dispersant and aqueous wetting agent into drying box for drying at 100℃ for 2 hours, heating epoxy resin and film-forming resin to high flow dynamic of 100℃ and vacuumizing for many times by a drying box, pumping small bubbles in the epoxy resin; (ii) adding ethylene glycol diglycidyl ether and propylene glycol methyl ether into epoxy resin, adding the dried powder mixture of step (i), adding into epoxy resin and film forming resin, heating and reducing mixture and placing into a vacuum stirrer to stir, according to the viscosity of the compound, setting different parameters for stirring and defoaming for many times, uniformly dispersing the filler into the resin matrix; and (iii) adding the epoxy resin curing agent, adding the mixture of step (ii), and stirring and defoaming in the vacuum stirrer to obtain the adhesive film.