▎ 摘　　要

NOVELTY - Preparing dispersion graphene involves obtaining components of graphene of dispersion liquid i.e. graphene quantum dots, graphene, dispersant and surfactant for metallization of printed circuit board (PCB) plate hole, placing dispersant and surfactant in dispersion medium for dispersion operation to obtain dispersing liquid; adding graphene quantum dots and graphene grinding dispersed solution after stirring treatment to obtain PCB board hole for metallizing graphene liquid. USE - Method for preparing dispersion graphene used for metallization of printed circuit board plate hole. ADVANTAGE - The method enables to reduce structure defect of graphite, and realizes high conductivity and high graphene of dispersion liquid for metallization of PCB plate hole. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a graphene dispersion liquid for metallizing PCB board hole, which is prepared by preparation method of dispersion graphene for metallizing PCB board hole, and comprises pH regulator, antifoaming agent or thickening agent.