• 专利标题:   Preparing dispersion graphene for metallization of printed circuit board plate hole, involves placing dispersant and surfactant in dispersion medium for dispersion to obtain dispersing liquid, and adding graphene quantum dots and graphene grinding dispersed solution after stirring treatment.
  • 专利号:   CN115974063-A
  • 发明人:   HAO L, BAI J, DONG B, FANG B, XIE D, WANG J
  • 专利权人:   GUANGDONG YINA TECHNOLOGY CO LTD
  • 国际专利分类:   C01B032/194
  • 专利详细信息:   CN115974063-A 18 Apr 2023 C01B-032/194 202340 Chinese
  • 申请详细信息:   CN115974063-A CN11710181 29 Dec 2022
  • 优先权号:   CN11710181

▎ 摘  要

NOVELTY - Preparing dispersion graphene involves obtaining components of graphene of dispersion liquid i.e. graphene quantum dots, graphene, dispersant and surfactant for metallization of printed circuit board (PCB) plate hole, placing dispersant and surfactant in dispersion medium for dispersion operation to obtain dispersing liquid; adding graphene quantum dots and graphene grinding dispersed solution after stirring treatment to obtain PCB board hole for metallizing graphene liquid. USE - Method for preparing dispersion graphene used for metallization of printed circuit board plate hole. ADVANTAGE - The method enables to reduce structure defect of graphite, and realizes high conductivity and high graphene of dispersion liquid for metallization of PCB plate hole. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a graphene dispersion liquid for metallizing PCB board hole, which is prepared by preparation method of dispersion graphene for metallizing PCB board hole, and comprises pH regulator, antifoaming agent or thickening agent.