▎ 摘　　要

NOVELTY - Manufacturing a molded ceramic composite material, comprises: (a) providing a preform having a first configuration and having two opposed surfaces, where the preform comprises a ceramic composite material, and the material comprises ceramic particles within a ceramic matrix; (b) thermoforming the preform comprising (i) heating the preform in a mold to a temperature greater than a melting or softening temperature of the ceramic matrix and preferably less than a melting or degradation temperature of the ceramic particles, and (ii) applying a load to the mold, where the first configuration of the preform within the mold is converted to a second configuration to form the molded ceramic composite material; (c) cooling the molded ceramic composite material in the mold; and (d) removing the molded ceramic composite material from the mold. The particles have a platelet configuration disposed in a parallel alignment. USE - The process is useful for manufacturing molded ceramic composite material which is used as thermal management device, heat sink or heat spreader for printed circuit board, heat exchanger, cold plate, low-loss dielectric RF component, radome, power inverter, solar cell, neutron shield, high temperature heat shield, heat shield for cube satellite, encapsulant or medical device (claimed). ADVANTAGE - The process: has an in-plane thermal conductivity, transverse to the thickness dimension of 5-100 W/mK, preferably 10-40 W/mK at ambient temperature; difficulties of fabricating complex shapes from ceramic matrix composites into thin and lightweight geometries capable of maximizing heat transfer; and employs a tape casting and vibration process that results in a highly oriented and percolated microstructure, which allows for thermoforming of these ceramic composite materials. Thermal management materials and devices so produced can allow for electrical insulation, while maintaining both good thermal conductivity and robust mechanical strength and toughness. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: fabricating a thermal management device for heat producing component; and a device for thermal management of heat producing component.