▎ 摘　　要

NOVELTY - A flexible, low shrinkage, conductive formulation comprises 75-95 wt.% sinterable, conductive metal particles, 0.2-5 wt.% graphene, 1-20 wt.% diluent, and 0-20 wt.% polymer resin, in which sinterable, conductive metal particles are optionally surface treated and have particle size of 1 nm to 50 mu m; graphene particles are optionally surface treated and have particle size of 1 nm to 50 mu m; diluent is low viscosity, reactive or non-reactive material; polymer resin is thermoset or thermoplastic; and formulation is sinterable at not greater than 250 degrees C. USE - A flexible, low shrinkage, conductive formulation for coating substrate of articles and filling gaps in electronic packages (all claimed). ADVANTAGE - Addition of graphene to formulation containing sinterable metal particles reduces curing shrinkage and brittleness and improves flexibility, without significantly affecting the EMI shielding performance of formulation. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: (1) article comprising sintered aliquot of conductive formulation applied to suitable substrate; (2) method to achieve electromagnetic interference (EMI) shielding of electronic package which involves applying conductive formulation to package and subjecting package to conditions suitable to sinter formulation; (3) shielded article comprising electronic package in which greater than or equal to 1 gaps are filled with sintered formulation; (4) reduction of shrinkage of formulation comprising sinterable metal particles upon sintering formulation which involves introducing 0.2-5 wt.% graphene into formulation prior to sintering; and (5) reduction of brittleness of formulation comprising sinterable metal particles upon sintering formulation which involves introducing 0.2-5 wt.% graphene into formulation prior to sintering.