• 专利标题:   Heat conductive resin composition used as sealing material and packaging material, comprises resin, and filler having thermal conductivity dispersed in resin, where filler comprises graphene oxide-coated aluminum oxide particles.
  • 专利号:   JP2020117573-A
  • 发明人:   TSUKADA Y, ITO Y, MIZUTA Y, KIBA S, ZAIMA H, ITO G, NISHIURA K
  • 专利权人:   MITSUI CHEM INC
  • 国际专利分类:   C08K003/22, C08K003/38, C08K009/02, C08L083/04, H01L023/36, H01L023/373
  • 专利详细信息:   JP2020117573-A 06 Aug 2020 C08L-083/04 202065 Pages: 14 Japanese
  • 申请详细信息:   JP2020117573-A JP007618 21 Jan 2019
  • 优先权号:   JP007618

▎ 摘  要

NOVELTY - Heat conductive resin composition comprises a resin, and a filler having thermal conductivity dispersed in the resin, where the filler comprises graphene oxide-coated aluminum oxide particles in which graphene oxide is present on the surface of the aluminum oxide particles. USE - The resin composition is used in heat conductive sheet, an electronic component (claimed) and child parts, and as a sealing material, a packaging material, an adhesive material for electronic parts, an insulating protective film, and a heat conduction material. ADVANTAGE - The resin composition has improved thermal conductivity without impairing the insulating property, improves the efficiency of heat transfer from the electronic component to the heat dissipation member while suppressing short-circuiting the electronic component, and improves the operational reliability of the electronic component. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for the following: (1) a heat conductive sheet obtained by curing the resin composition; and (2) an electronic component in which a heat dissipation member is joined via the heat conductive sheet.