▎ 摘　　要

NOVELTY - The method involves plating a metal adhesive layer (2) on a surface of a graphene film base body (1) by magnetic control sputtering method. A metal plating layer (3) is plated on the surface of the metal adhesive layer by electroplating method. The surface metallized graphene film is obtained. The metal adhesion layer and the metal plating layer have the same metal types. The metal type of the metal plating layer is copper (Cu). The electrolyte is prepared from Copper sulfate pentahydrate (CuSO4.5H2O), sulfuric acid (H2SO4) with a concentration of 37% to 38%, glucose and deionized water. USE - Method for metallizing surface of graphene film (claimed) in electronic device. ADVANTAGE - The method improves the bonding force of the plated metal and graphene film substrate, ensures the mutual adaptability of two plating layers, increases the uniformity of the composite plating layer, has thicker obtained plating, higher efficiency, better wear resistance and welding performance. The plating thickness can be controlled, high efficiency, low cost, and large scale application potential. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of the graphene film. 1Graphene film base body 2Metal adhesive layer 3Metal plating layer