• 专利标题:   Graphene heat conductive PCB, has PCB has graphene sheet connected with inner layer core board, and prepreg arranged between graphene sheet and inner layer core board, where side of graphene sheet is connected with copper foil.
  • 专利号:   CN110602871-A
  • 发明人:   SUN L, XIE F, JIANG Y, ZHU H, TANG Z, MAO B
  • 专利权人:   WUS PRINTED CIRCUIT CO LTD
  • 国际专利分类:   H05K001/02, H05K003/00, H05K003/46
  • 专利详细信息:   CN110602871-A 20 Dec 2019 H05K-001/02 202001 Pages: 7 Chinese
  • 申请详细信息:   CN110602871-A CN10869482 16 Sep 2019
  • 优先权号:   CN10869482

▎ 摘  要

NOVELTY - The PCB has a graphene sheet whose multiple layers are connected with an inner layer core board. A prepreg is arranged between the graphene sheet and the inner layer core board. A side of the graphene sheet away from the inner layer core board is connected with a copper foil. USE - Graphene heat conductive PCB. ADVANTAGE - The PCB can improve radiating performance, and effectively maintains an insulating state between the graphene sheet and the core plate without affecting circuit signal transmission. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a Graphene heat conductive PCB manufacturing method. DESCRIPTION OF DRAWING(S) - The drawing shows a sectional view of a graphene heat conductive PCB.