▎ 摘　　要

NOVELTY - Preparing high-strength graphene-based thermally conductive film comprises (i) heating graphene at 400-600?, incubating, rising the temperature and naturally cooling to room temperature; (ii) adding the treated graphene to organic polymer solution, adding dispersing auxiliary agent, stirring, heating, adding silane coupling agent, stirring, removing supernatant by centrifugation, collecting the lower graphene precipitate and drying in oven to obtain modified graphene; (iii) mixing modified graphene, silicon dioxide, epoxy acrylate resin, bisphenol A type epoxy resin and terminal carboxylated nitrile rubber with isooctyl acrylate, stirring and mixing, cooling, sequentially adding azelaic acid dihydrazide, phthalic hydrazide, alpha -ethyl cyanoacrylate, epoxy chloropropane, methylbutylammonium bromide and hydrogenated rosin under stirring at constant temperature to obtain mixed solution; and (iv) casting, spin coating or paving the obtained mixed solution on the mold plate and drying. USE - The method is useful for preparing high-strength graphene-based thermally conductive film. ADVANTAGE - The film has good mechanical property and thermal conductivity. DETAILED DESCRIPTION - Preparing high-strength graphene-based thermally conductive film comprises (i) heating 100 pts. wt. graphene at 400-600 degrees C at a rate of 0.5-2 degrees C/minute under an inert gas atmosphere, incubating for 1-2 hours, rising the temperature to 800-1200 degrees C at a rate of 2-5 degrees C/ minute, maintaining for 0.5-1 hours and naturally cooling to room temperature; (ii) adding the treated graphene to 20-50 pts. wt. organic polymer solution, adding 10-20 pts. wt. dispersing auxiliary agent, stirring at room temperature for 15-30 minutes, heating to 50-60 degrees C, adding 3-6 pts. wt. silane coupling agent, stirring for 1-2 hours, removing supernatant by centrifugation, collecting the lower graphene precipitate and drying in oven to obtain modified graphene; (iii) mixing 15-25 pts. wt. modified graphene, 10-18 pts. wt. silicon dioxide, 12-20 pts. wt. epoxy acrylate resin, 10-20 pts. wt. bisphenol A type epoxy resin and 7-15 pts. wt. terminal carboxylated nitrile rubber with 80-100 pts. wt. isooctyl acrylate, stirring and mixing for 40-60 minutes at 100-130 degrees C, cooling to 50-70 degrees C, sequentially adding 4-9 pts. wt. azelaic acid dihydrazide, 3-6 pts. wt. phthalic hydrazide, 5-10 pts. wt. alpha -ethyl cyanoacrylate, 2-5 pts. wt. epoxy chloropropane, 1-4 pts. wt. methylbutylammonium bromide and 3-8 pts. wt. hydrogenated rosin under stirring at constant temperature for 1.5-3 hours to obtain mixed solution; and (iv) casting, spin coating or paving the obtained mixed solution on the mold plate and drying. An INDEPENDENT CLAIM is also included for the high-strength graphene-based thermally conductive film obtained by the above method.