▎ 摘　　要

NOVELTY - A heat conducting gasket comprises heat conducting films, where heat conducting film is formed with through holes passing through upper and lower surfaces of heat conducting film. The multiple through holes are distributed with adhesive. The layers of multiple layers of heat conducting films are distributed with adhesive and heat conducting filler. USE - The heat conduction gasket is used in electronic device for heat conduction and radiation (claimed). DETAILED DESCRIPTION - INDEPENDENT CLAIMS are included for: (1) preparation of the heat conducting gasket comprising forming through holes through upper and lower surface of heat conducting film on heat conducting film, preferably heat conducting film is graphene heat conducting foam film; dispersing heat conducting filler in adhesive diluted by solvent, or directly dispersing heat conducting filler in adhesive to prepare adhesive; dipping heat conducting film formed with multiple through holes in adhesive or dipping in dipping glue, where dipping glue is obtained by diluting adhesive by solvent; using adhesive glue, laminating and adhering to block; and solidifying and forming lock, and cutting into sheet along laminating direction; and (2) electronic device comprising thermally conductive pad.