▎ 摘　　要

NOVELTY - Formulation comprises graphene having at least one structural layer, and a base polymer, where the graphene is dispersed in the base polymer. USE - The formulation is useful for conduction of heat between an electronic component and a heat sink, in the heat sink assembly (all claimed), and in electronic devices. ADVANTAGE - The formulation provides the heat-sink film for dissipation of heat, and facilitates a cost-effective and environment-friendly heat-sink film. DETAILED DESCRIPTION - INDEPENDENT CLAIMS are also included for: (1) heat sink assembly comprises a heat source, a heat sink, a heat-sink film consisting of the formulation, arranged between the heat source and the heat sink; and (2) manufacturing a formulation comprising providing graphene having at least one structural layer, and dispersing the graphene into a base polymer or monomer.