▎ 摘　　要

NOVELTY - Performing directional arrangement of graphene materials and composite molding with silica gel pad involves drying the heat conductive powder filler while heating in a vacuum environment to remove excess water to obtain dry heat conductive powder filler. The dry heat conductive powder filler prepared are added with 50-800 pts. wt. methyl vinyl silicone oil, 12-35 pts. wt. hydrogen-containing silicone oil, 1-4 pts. wt. coupling agent, 0.5-6 pts. wt. catalyst and 0.3-2 pts. wt. inhibitor and mixed under stirring at low speed under normal temperature vacuum environment to obtain mixed paste base. A portion of mixed paste base is subjected to calendering, where the thickness of the gasket after calendering is 1/4 to 3/4 of the thickness of the target thermal silica gel gasket product, and then subjected to high temperature vulcanization molding to get basic heat conduction gasket. USE - Method for performing directional arrangement of graphene materials and composite molding with silica gel pad. ADVANTAGE - The method enables to perform directional arrangement of graphene materials and composite molding with silica gel pad, which allows to realize good orientation arrangement, excellent heat equalizing and high-performance of heat conducting in gasket , solves the problem of non-high strength existing graphene with heat conducting silica gel pad binding process and easy falling off. DETAILED DESCRIPTION - 1-2 pts. wt. Hydrogenated silicone oil, 0.5-4 pts. wt. coupling agent, 0.2-1 pts. wt. catalyst, 50-300 pts. wt. organic volatile diluent solvent, 10-50 pts. wt. graphene and 0.5-2 pts. wt. inhibitor are addedn and mixed under uniform stirring at a high temperature to normal temperature, and after the graphene is completely dispersed uniformly graphene dispersion is obtained. The base thermal conductive gasket is used as a substrate, and graphene dispersion prepared is uniformly sprayed or coated on the upper surface of the base thermal conductive gasket substrate, and then heated to the organic volatile diluent solvent completely, then subjected to volatilizing, and the graphene is arranged in a regular parallel on the upper surface of the thermal pad substrate, and the unsaturated group in the substrate containing vinyl group adsorbed on the surface of the graphene and the thermally conductive gasket substrate and hydrogen silicone oil cross-links reaction, so that the graphene layer is firmly adhered to the upper surface of the thermal pad substrate, and thermal conductive gasket with an oriented layer of graphene adhered to the upper surface is obtained. The thermal conductive gasket on which the upper surface of the mixed graphene layer prepared is attached is used as the substrate, and the other portion of the mixed paste base is pressed on the upper surface of the substrate, and is subjected to high temperature, then subjected to vulcanization molding, which is a target thermal conductive silicone gasket product with oriented arrangement of graphene materials and composite molding with silica gel pad.