• 专利标题:   Protective assembly for use in touch module, comprises buffer layer disposed on the cover plate and made of transparent polymer, and flexible substrate disposed on the buffer layer and doped with inorganic compound.
  • 专利号:   US2023185410-A1
  • 发明人:   CHENG T, LEE L, JI L J, CHEN X M, LIU J
  • 专利权人:   TPK ADVANCED SOLUTIONS INC
  • 国际专利分类:   B32B027/08, B32B027/28, B32B027/30, B32B027/36, B32B027/38, B32B007/12, G06F003/044
  • 专利详细信息:   US2023185410-A1 15 Jun 2023 G06F-003/044 202353 English
  • 申请详细信息:   US2023185410-A1 US550424 14 Dec 2021
  • 优先权号:   US550424

▎ 摘  要

NOVELTY - Protective assembly (200) comprises a cover plate (210); a buffer layer (220) disposed on the cover plate and made of transparent polymer, buffer layer having a light transmittance greater than 85%, a thickness ranging from 3-15 μm, and a Poisson's ratio greater than 0.4; and a flexible substrate (110) disposed on the buffer layer and doped with an inorganic compound. The flexible substrate has a thickness ranging from 3 μm to 10 μm and a Young's coefficient ranging from 1-10 gigapascals. USE - Protective assembly for use in touch module (claimed). ADVANTAGE - The resistance of the circuits in the touch module can be effectively reduced, so that the touch module is suitable for use in medium and large-sized products. The problem of cracks in the electrode pattern layer disposed on the first insulating layer can be effectively improved. The contact areas between the first electrode blocks of the electrode pattern layer and the bridging electrode can be increased, for reducing the impedance. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a touch module. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of the protective assembly. 110Flexible substrate 140Electrode pattern layer 200Protective assembly 210Cover plate 220Buffer layer