▎ 摘　　要

NOVELTY - Thermally conductive structure has a thermally conductive metal layer having a first surface (111) and a second surface (112) opposite the first surface. A first carbon nanotube layer is arranged on the first surface of the thermally conductive metal layer. The first carbon nanotube layer includes a set of first carbon nanotubes. A first thermally conductive adhesive layer (13) is arranged on the first carbon nanotube layer. The material of the first thermally conductive adhesive layer is filled in the gaps of the set of first carbon nanotubes. A ceramic protective layer (14) is arranged on the side of the first carbon nanotube layer away from the thermally conductive metal layer. USE - Thermally conductive structure for use in an electronic device (claimed). ADVANTAGE - The thermally conductive structure quickly conducts the heat generated by the heat source of the electronic device to the outside, and improves the heat dissipation efficiency of the electronic device. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for an electronic device, which comprises heat source, and the thermally conductive structure, which is connected to the heat source. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of thermally conductive structure. 11Vertical heat-conducting metal layer 12First carbon nano-tube layer 13First thermally conductive adhesive layer 14Ceramic protective layer 111First surface 112Second surface 121Second carbon nano-tube 131Rubber material