▎ 摘　　要

NOVELTY - Double-surface micro-structure electrode and paper based flexible pressure sensor has a conductive paper layer (1) whose upper and lower portions are respectively provided with a micro-structure electrode layer (2). A periphery of the conductive paper layer and the micro-structure electrode layer are provided with a packaging layer (4). The micro-structure electrode layer is led out of a test wire (3). The test wire is extended to an outer side of the packaging layer. The micro-structure electrode layer is provided with a fabric and a first electrically conductive material that is attached to the fabric. The micro-structure electrode layer is provided with a second electrically conductive material. USE - Double-surface micro-structure electrode and paper based flexible pressure sensor. ADVANTAGE - The upper and lower surfaces of the single-layer electric paper layer are jointed with the micro-structure electrode layer to form a double-sided contact interface so as to greatly increase variable of the contact interface and improve pressure sensitive response of the flexible pressure sensor. The sensor has high sensitivity, better repeating stability and simple preparation process, and is inexpensive. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for preparing double-surface micro-structure electrode and paper based flexible pressure sensor, which involves compounding the paper with the second conductive material to obtain a conductive paper layer, combining the fabric with the first conductive material to obtain a microstructure electrode layer, combining the upper and lower surfaces of the conductive paper layer with the microstructure electrode layer, and drawing the test lead from the microstructure electrode layer, encapsulating with insulating tape to prepare an encapsulation layer to obtain a flexible pressure sensor. DESCRIPTION OF DRAWING(S) - The drawing shows a schematic view of double-surface micro-structure electrode and paper based flexible pressure sensor. Conductive paper layer (1) Micro-structure electrode layer (2) Test wire (3) Packaging layer (4)