▎ 摘　　要

NOVELTY - Semiconductive composition comprises a base resin and a conductive additive. The base resin includes crystalline polyolefin resin having melting point of ≥ 120° C and a melting index of 0.1-1.5. The sheath layer specimen formed from the semiconductive composition has modulus of ≥ 30 kgf/mm2at 5% tensile strength, Shore D hardness of ≥ 60 at 25° C, and Shore D hardness of ≥ 55 at 60° C. USE - The composition is useful for forming sheath layer of cable (claimed). ADVANTAGE - The composition: has high durability; and excellent physical properties i.e. room temperature mechanical properties i.e. room temperature tensile strength, room temperature modulus, heat resistance, stable electrical properties at room temperature and high temperature, stable hardness at room temperature and high temperature, and extrudability.