• 专利标题:   Preparing low-silver aqueous conductive silver paste for e.g. polyethylene terephthalate film, involves ball-milling adhesive, defoaming agent, dispersant and non-metal conductive powder to obtain dispersion liquid, adding silver powder to disperse to obtain slurry, and defoaming.
  • 专利号:   CN113436805-A
  • 发明人:   MEN Z, HAN Z, SONG Q
  • 专利权人:   HIT ROBOT GROUP WUXI SCI TECHNOLOGY
  • 国际专利分类:   H05K001/09, H01B005/14, H01B001/24, H01B001/22, H01B013/00
  • 专利详细信息:   CN113436805-A 24 Sep 2021 H01B-013/00 202199 Chinese
  • 申请详细信息:   CN113436805-A CN10472371 29 Apr 2021
  • 优先权号:   CN10472371

▎ 摘  要

NOVELTY - A preparation method of low-silver aqueous conductive silver paste, involves (1) adding adhesive, defoaming agent, dispersant and non-metal conductive powder to a ball-milling tank according to the proportion, and ball-milling for a period of time to obtain dispersion liquid, (2) adding the silver powder to the dispersion liquid obtained in the step (1) to disperse to obtain slurry, and (3) taking out the slurry obtained in the step (2), and defoaming. USE - Preparation method of low-silver aqueous conductive silver paste for polyethylene terephthalate film, polyimide film, and aluminum foil (claimed). ADVANTAGE - The method enables the preparation of low-silver aqueous conductive silver paste with excellent electrical conductivity, flexibility and resistance to humidity and heat, when applied to film materials. The compounding of silver powder and carbon-based powder can effectively avoid the sedimentation of the silver powder, and contacts with the silver powder to form a conductive path to improve conductivity. The amount of silver powder used is reduced, so that the material cost of the paste is reduced. The use of water-soluble binders does not pollute the environment and endanger the health of workers. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for an application of low-silver aqueous conductive silver paste in polyethylene terephthalate film, polyimide film, aluminum foil or other film materials to form a stably attached conductive circuit layer or conductive film layer.