▎ 摘　　要

NOVELTY - Low-dielectric heat-conducting polyimide comprises 10-15 pts. wt. dianhydride monomer, 10-15 pts. wt. diamine monomer, 100-150 pts. wt. solvent B, 0.05-0.1 pts. wt. coupling agent, 0.05-0.1 pts. wt. auxiliary agent, and 100-150 pts. wt. solvent A. USE - The low-dielectric heat-conducting polyimide film is useful in space technology, F, H-level motor, insulation of electric appliance, FPC (flexible printed circuit board), PTC electrothermal film, TAB (pressure-sensitive adhesive tape base material), aerospace, aviation, computer, electromagnetic wire, transformer, sound, mobile phone, mining electronic component industry, automobile, traffic transportation, atomic industry and electronic appliance industry. ADVANTAGE - The low-dielectric heat-conducting polyimide film has a lower dielectric constant and a higher heat conductivity coefficient. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a preparation method of the low-dielectric heat-conducting polyimide.