• 专利标题:   Fabricating graphene sheets that are useful in field of nanoelectronics to form basic component of electronics e.g. transistor, by depositing hologenated aromatic molecules on substrate under ultra high vacuum, and polymerizing molecules.
  • 专利号:   FR2978136-A1
  • 发明人:   SCHULL G, BULOU H, ROMEO M, SCHEURER F
  • 专利权人:   CENT NAT RECH SCI
  • 国际专利分类:   B82Y040/00, C01B031/04
  • 专利详细信息:   FR2978136-A1 25 Jan 2013 C01B-031/04 201314 Pages: 14 French
  • 申请详细信息:   FR2978136-A1 FR002261 20 Jul 2011
  • 优先权号:   FR002261

▎ 摘  要

NOVELTY - The process comprises depositing hologenated aromatic molecules on a monocrystalline or polycrystalline substrate under ultra high vacuum, polymerizing the hologenated aromatic molecules by thermally treating or heating the substrate at a temperature of 200-350 degrees C, by exposing the substrate to a light beam and/or by electron bombardment, and detaching graphene sheets from the substrate by etching the sheets in a strong acid solution. The deposition step is carried out at a pressure of less than 10-9 mbar, and is carried out by thermal evaporation at a temperature of 100-350 degrees C. USE - The process is useful for fabricating graphene sheets, which are useful in the field of nanoelectronics to form basic components of electronics such as transistors. ADVANTAGE - The process is capable of simply and economically fabricating the graphene sheets with excellent mechanical properties thus enhancing the operation efficiency of the transistors. DETAILED DESCRIPTION - The process comprises depositing hologenated aromatic molecules on a monocrystalline or polycrystalline substrate under ultra high vacuum, polymerizing the hologenated aromatic molecules by thermally treating or heating the substrate at a temperature of 200-350 degrees C, by exposing the substrate to a light beam and/or by electron bombardment, and detaching graphene sheets from the substrate by etching the sheets in a strong acid solution. The deposition step is carried out at a pressure of less than 10-9 mbar, and is carried out by thermal evaporation at a temperature of 100-350 degrees C. The substrate has a specific orientation of (100), (111) or (110), and is a metal, semiconductor or insulator substrate.