• 专利标题:   Integrated circuit structure for use in computing device, has dielectric layer that surrounds and continuous between first disk electrode and second disk electrode, and electrode layer that is provided along pole between disk electrodes.
  • 专利号:   US2022140069-A1
  • 发明人:   LIN C, CLENDENNING S B, CAUDILLO R, SHARMA A A, CHANDHOK M, NASKAR S
  • 专利权人:   INTEL CORP
  • 国际专利分类:   H01L027/108, H01L049/02
  • 专利详细信息:   US2022140069-A1 05 May 2022 H01L-049/02 202245 English
  • 申请详细信息:   US2022140069-A1 US578839 19 Jan 2022
  • 优先权号:   US828497, US578839

▎ 摘  要

NOVELTY - Integrated circuit structure of DRAM memory comprises a pole (112); a first disk electrode (123) surrounding and in contact with a first portion of the pole; a second disk electrode (121) surrounding and in contact with a second portion of the pole, the second disk electrode over and spaced apart from the first disk electrode; a dielectric layer (105) surrounding and continuous between the first disk electrode and the second disk electrode, the dielectric layer along the pole between the first disk electrode and the second disk electrode; and an electrode layer surrounding the dielectric layer, the electrode layer along the pole between the first disk electrode and the second disk electrode. USE - The integrated circuit structure is useful for computing device (claimed). ADVANTAGE - The semiconductor device has high power density, good performance, and long maintenance-free lifetime. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a computing device. DESCRIPTION OF DRAWING(S) - The drawings show schematic view of semiconductor device. Dielectric layer (105) Interface layer (107) Pole (112) Second electrode (121) First electrode (123)