• 专利标题:   Thermal conducting composite material useful in printed circuit board circuit board and electronic packaging thermal interface materials and other fields, comprises graphene/copper composite material as thermally conductive filler.
  • 专利号:   CN106674904-A
  • 发明人:   SUN R, LIU S, FU X
  • 专利权人:   SHENZHEN INST ADVANCED TECHNOLOGY
  • 国际专利分类:   C08K013/06, C08K003/04, C08K007/18, C08K009/06, C08L063/00, C09K005/14
  • 专利详细信息:   CN106674904-A 17 May 2017 C08L-063/00 201747 Pages: 14 Chinese
  • 申请详细信息:   CN106674904-A CN11260069 30 Dec 2016
  • 优先权号:   CN11260069

▎ 摘  要

NOVELTY - Thermal conducting composite material comprises graphene/copper composite material as thermally conductive filler. USE - The thermal conducting composite material is useful in printed circuit board circuit board and electronic packaging thermal interface materials and other fields. ADVANTAGE - The composite material has good thermal conductivity and good mechanical properties. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for preparing thermal conducting composite material comprising (i) mixing thermally conductive graphene/copper composite material, resin base and optionally coupling agent and/or accelerator to obtain a mixture, (ii) adding mixture into mixing tank, and then placing mixing tank in mixer in vacuum mixture to uniform and (iii) slurring mixture to complete into mold for curing to obtain final product.