• 专利标题:   Conductive epoxy resin comprises bisphenol A type epoxy resin, amine curing agent, conductive filler comprising carbon nanotubes, and another conductive filler comprising graphene oxide, silane coupling agent and heat stabilizer.
  • 专利号:   CN110343368-A
  • 发明人:   XU D, FU Z, YAO W, WANG X, LI S, PAN G, LIU F, SHI T, DOU Y, GUAN D
  • 专利权人:   CHANGCHUN APPLIED CHEM INST CHINESE ACAD, UNIV JILIN
  • 国际专利分类:   C08G059/50, C08K013/04, C08K003/04, C08K007/00, C08K007/06, C08L063/00
  • 专利详细信息:   CN110343368-A 18 Oct 2019 C08L-063/00 201986 Pages: 13 Chinese
  • 申请详细信息:   CN110343368-A CN10703039 31 Jul 2019
  • 优先权号:   CN10703039

▎ 摘  要

NOVELTY - Conductive epoxy resin comprises 50-100 pts. wt. bisphenol A type epoxy resin, 20-50 pts. wt. amine curing agent, 10-30 pts. wt. first conductive filler, 10-30 pts. wt. second conductive filler, 0.5-2 pts. wt. silane coupling agent and 3-5 pts. wt. heat stabilizer. The first conductive filler comprises carbon nanotubes, vapor deposited carbon fibers and/or conductive carbon fibers. The second conductive filler comprises graphene, graphene oxide and/or conductive graphite. The second conductive filler is sheet-shaped or layer-shaped. USE - As conductive epoxy resin. ADVANTAGE - The epoxy resin is formed by two kinds of different dimensional conductive fillers to form a conductive epoxy resin with double network structure, and has excellent electrical conductivity and thermal stability. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is included for a method for preparing the epoxy resin involving (A1) mixing the first conductive filler, the second conductive filler and the silane coupling agent and ultrasonically processing at 40-60 degrees C for 30-60 minutes to obtain a composite slurry, (B1) stirring and mixing the composite slurry with the bisphenol A type epoxy resin to obtain a resin slurry, (C1) stirring and mixing the resin slurry and the heat stabilizer, and (D1) stirring and mixing the slurry after step (C1) with the amine curing agent, performing defoaming treatment under vacuum conditions, solidifying and molding to obtain the product, or (A2) mixing the first conductive filler, the second conductive filler, the silane coupling agent and the solvent and ultrasonically processing at 40-60 degrees C for 30-60 minutes to obtain a mixed suspension, (B2) stirring and mixing the mixed suspension with a bisphenol A type epoxy resin to obtain a resin slurry, (C2) removing the solvent in the resin slurry to obtain the resin slurry, (D2) stirring and mixing the resin slurry and the heat stabilizer, and (E2) stirring and mixing the slurry obtained in step (D2) with the amine curing agent, performing defoaming treatment under vacuum conditions, solidifying and molding to obtain the product.