• 专利标题:   Graphene heating chip based electric floor heating insulation structure, has graphene heating chip main body whose top part is paved with protective layer, where top part of protective layer is paved with cement layer that is paved with floor.
  • 专利号:   CN211369399-U
  • 发明人:   ZHENG Y
  • 专利权人:   KINGBOARD FLOOR HEATING TECHNOLOGY QINGY
  • 国际专利分类:   E04F015/02, E04F015/18, F24D013/02, F24D019/10
  • 专利详细信息:   CN211369399-U 28 Aug 2020 E04F-015/02 202072 Pages: 9 Chinese
  • 申请详细信息:   CN211369399-U CN22223051 12 Dec 2019
  • 优先权号:   CN22223051

▎ 摘  要

NOVELTY - The utility model claims an electric floor heating insulating structure based on graphene heating chip, comprising a laying layer, a first protective layer, a graphene heating chip main body, a second protective layer and a DMD-1.3 temperature controller; the top of the laying layer is paved with a first protective layer; the top of the first protective layer is paved with graphene heating chip main body; the graphene heating chip main body is connected with a DMD-1.3 temperature controller through lead, the top part of the graphene heating chip main body is paved with a second protective layer; the top of the second protective layer is paved with a cement layer; the top of the cement layer is paved with a floor. The utility model is provided with a DMD-1.3 temperature controller; the temperature of the graphene heating chip main body can be controlled by the DMD-1.3 temperature controller; it avoids the potential safety hazard of the temperature of the graphene heating chip main body; The electric floor heating insulating structure based on graphene heating chip is provided with a cement layer, the cement layer can protect the floor, avoiding floor deformation caused by too large floor temperature difference.