▎ 摘　　要

NOVELTY - Preparing copper/graphene film laminated composite material, comprises (1) processing copper foil, titanium foil, and graphene film into a disc with a diameter of 30 mm, using a hole punch to punch holes in the wafer, in order to remove impurities and oxides on the surface, pickling perforated wafers ultrasonically in hydrochloric acid solution, washing with absolute ethanol, and drying in a drying oven, (2) molding the wafer in the order of copper-titanium-GN-titanium, and filling the holes in the GN with copper powder, and (3) pre-pressing the mold at 10MPa in advance, placing in the sintering furnace cavity, setting the calcining program, and calcining, and completing the preparation of the layered composite material under vacuum conditions. USE - The method for preparing copper/graphene film laminated composite material used in electronic packaging material for electronic device. ADVANTAGE - The method solves the defect of bad wettability between the copper and graphene, ensures the connection strength of the material, and avoids the defects of cracking under the action of the thermal stress. DETAILED DESCRIPTION - AN INDEPENDENT CLAIM is also included for copper/graphene film laminated composite material, obtained by the method as mentioned above.