• 专利标题:   Method for improving heat dissipation of LED, involves respectively utilizing graphene and its derivative graphene oxide as external dopants to increase thermal conductivity of epoxy resin composite material and improves heat dissipation of epoxy resin encapsulated LED.
  • 专利号:   CN113667278-A
  • 发明人:   LI J, YI X, CUI K, DING H, XIE H
  • 专利权人:   UNIV CHANGSHA SCI TECHNOLOGY
  • 国际专利分类:   C08K003/04, C08L063/02, C09K005/14, H01L033/56
  • 专利详细信息:   CN113667278-A 19 Nov 2021 C08L-063/02 202238 Chinese
  • 申请详细信息:   CN113667278-A CN10980691 25 Aug 2021
  • 优先权号:   CN10980691

▎ 摘  要

NOVELTY - The method for improving LED heat dissipation, involves respectively utilizing graphene and its derivative graphene oxide as external dopants to increase thermal conductivity of epoxy resin composite material and improve heat dissipation of epoxy resin encapsulated LED. USE - Method for improving heat dissipation of LED, using graphene-modified epoxy resin. ADVANTAGE - The graphene oxide better improves the thermal conductivity of epoxy resin, and by adding external dopant graphene and derivative graphene oxide to epoxy resin, the thermal conductivity of epoxy resin is improved, and the modified epoxy resin is utilized to complete the LED package, thereby improving the heat dissipation of LED. By adding certain amount of graphene, epoxy resin acts as thermal conduction node, which reduces the interface thermal resistance, and thermal conduction network is formed in polymer to transfer heat, thereby improving the thermal conductivity of composite material, and when graphene oxide is utilized as external dopant, the thermal conductivity of graphene oxide/epoxy composites is better, and the utilization of graphene modified epoxy resin to encapsulate the LED improves the heat dissipation of the LED.