• 专利标题:   Anti-falling earthquake-proof composite circuit board, has substrate whose lower end is plated with heat conducting plating layer, where lower side of heat conducting plating layer is formed with graphene that is formed with ceramic heat dissipation layer.
  • 专利号:   CN211019533-U
  • 发明人:   HUANG Y, GUO X, JIANG D, ZHOU Y, LIAO H, LI H
  • 专利权人:   GANZHOU BEYOND SCITECH CO LTD
  • 国际专利分类:   F16F015/04, F16F015/08, H05K001/02, H05K005/02, H05K007/14, H05K007/20
  • 专利详细信息:   CN211019533-U 14 Jul 2020 H05K-005/02 202060 Pages: 8 Chinese
  • 申请详细信息:   CN211019533-U CN20898815 15 Jun 2019
  • 优先权号:   CN20898815

▎ 摘  要

NOVELTY - A composite circuit board anti-falling shock, comprising a shell cover and a shell, the shell is the upper end of case structure, upper end opening of the shell is provided with a shell cover, a shell cover of the upper end of the left side is fixedly connected with a first connecting rod; the lower end of the first connecting rod is vertically provided with a second connecting rod, the first connecting rod and the second connecting rod are hinged with each other by a hinge shaft, the lower end of the second connecting rod is fixedly connected with the third connecting rod, the third connecting rod and the second connecting rod are vertical to each other, the right side of the third connecting rod is fixedly connected with the shell; the lower end surface of the shell cover is uniformly fixedly connected with a plurality of telescopic rod, the telescopic rod comprises a slide mutually sleeved outer pipe and inner rod, the structure of this utility model is simple, the design is reasonable, the whole device has good earthquake resistance, good buffer performance, the whole working device can keep the stability and safety, at the same time, the service life of the circuit board is long.