▎ 摘　　要

NOVELTY - The structure has a mold connected with a pipe core through contacts. Different positions of a structure main body are contacted with the pipe core. A holding pin is connected with the pipe core through a through-hole. A channel is formed between the structure main body and the pipe core. USE - Three-dimensional packaging technology or non-three-dimensional packaging technology based graphene buffer layer structure for a power device. Can also be used as an electrode of a pipe core. ADVANTAGE - The structure improves heat-dispersing efficiency, conductivity-enhancing and stress relief of a power device. DESCRIPTION OF DRAWING(S) - The drawing shows a perspective view of a graphene buffer layer structure.