▎ 摘 要
NOVELTY - A heat-dissipating material comprises resin and graphene having an average thickness of 0.3-20 nm, and an element ratio of nitrogen to carbon (N/C ratio) measured by X-ray photoelectron spectroscopy of 0.005-0.020. USE - Heat-dissipating material used in electrical devices such as smartphones, computers and LED lighting devices. ADVANTAGE - The heat-dissipating material is light in weight and has excellent thermal conductivity.