▎ 摘　　要

NOVELTY - The device has a heat dissipation unit fixed on a semiconductor chip (CH). The heat dissipation unit comprises a resin and a fin protruding from the resin. The fin comprises graphene and arranged on the semiconductor chip such that the graphene is arranged in a direction crossing a surface of the semiconductor chip. The heat dissipation unit includes a rolled body in which a graphite sheet (GF) and a resin tape (R1) are layered and rolled. A sealing resin is formed on the semiconductor chip. The heat dissipation unit is embedded in the sealing resin. USE - Semiconductor device such as CPU for use in a portable terminal. ADVANTAGE - The device increases operating speed of the CPU of a portable terminal, and an operating frequency leads to increasing an effective current in proportion to the frequency, thus increasing a heat generation amount. The device realizes efficient heat dissipation by improving exposed area of the fin by using forced-air cooling in combination and optimizing wind velocity. DETAILED DESCRIPTION - An INDEPENDENT CLAIM is also included for a method of manufacturing a semiconductor device. DESCRIPTION OF DRAWING(S) - The drawing shows a cross-sectional view of a semiconductor device. Bump electrodes (BP) Semiconductor chip (CH) Graphite sheet (GF) Conductive portions (M1, M2) Resin tape (R1) Substrate (S) Stud bumps (SB)